Specific manufacturing process description of solar cell
(1) Slicing(China solar panel): the silicon rod is cut into square silicon wafer by multi wire cutting.
(2) Cleaning(China solar panel): use the conventional silicon wafer cleaning method, and then use acid (or alkali) solution to remove the cut damage layer on the silicon wafer surface by 30-50um.
(3) Preparation of suede(China solar panel): anisotropic etching of silicon wafer with alkali solution to prepare suede on the surface of silicon wafer.
(4) Phosphorus diffusion(China solar panel): the coating source (or liquid source or solid phosphorus nitride sheet source) is used for diffusion to make PN + junction, and the junction depth is generally 0.3-0.5um.